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Diamond Wafering Blade, 127x0.50x12.7mm, 20 LC

Diamond Wafering Blade, 127x0.50x12.7mm, 20 LC
Diamond Wafering Blade, 127x0.50x12.7mm, 20 LC
Item No: 114225

Overview

Diamond Wafering Blade, 127x0.50x12.7mm, Series 20 LC, metal bonded, High Quality, for use with medium to soft ceramics, electronic components, hard tough materials, structural ceramics, etc.

Specifications

Description Specification