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Diamond Wafering Blade, 203x0.90x12.7mm, 20 HC

Diamond Wafering Blade, 203x0.90x12.7mm, 20 HC
Diamond Wafering Blade, 203x0.90x12.7mm, 20 HC
Item No: 114238

Overview

Diamond Wafering Blade, 203x0.90x12.7mm, Series 20 HC, metal bonded, High Quality, for aggressive general sectioning of ferrous and non-ferrous materials

Specifications

Description Specification